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Vantec Announces a Comprehensive Line of SuperSpeed Plus USB 3.1 Products

Featuring two USB 3.1 models of Vantec’s NexStar enclosure for 2.5” and 3.5” SSDs and Hard Drives as well as a PCI-Express Host card for the fastest connectivity.

Vantec Thermal Technologies—a worldwide leader specializing in computer accessories, storage and mobile solutions—announces three new products utilizing the latest SuperSpeed+ USB 3.1 interface including new additions to our NexStar hard drive enclosures and a PCI-Express Host Controller card.



The new NexStar 3.1 series available in both 2.5” and 3.5” form factors are capable of speed up to 10Gbit/s at twice the speed of current USB 3.0 Technology. These NexStar 3.1 enclosures are using USB Type-A interface which is an establish platform that is widely available and fully compatible with older USB 3.0 or USB 2.0 devices. Both enclosures use the latest Gen II USB 3.1 chipset. It comes with features like USAP Support, Plug and Play, and brushed Aluminum for rigid and heat dissipation. These two storage enclosures also work hand in hand with the PCI-Express Host card to provide the best combination of this USB 3.1 technology.



The 2-Port USB 3.1 PCIe Host Card bears the same Gen II 10Gbit/s family of chipset which supports PCI Express Gen2x2, Gen3x1 specifications, UASP, and comes with two Type-A interface. The design of this card enables it to be fully compatible with USB 3.0 and legacy devices. This will makes it very convenient to connect any USB devices ranging from memory stick to massive storage device; this Host Card when couple with the NexStar 3.1 enclosures will make for a perfect match with the latest and Fastest Technology the industries can offer.
The Vantec SuperSpeed+ USB 3.1 products will be available on the market this early June. For additional product information and full technical specifications, please visit their HOMEPAGE.

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